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filingDate 2008-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0371e5f71acbcd73720cfb4ea53d158
publicationDate 2009-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009282491-A
titleOfInvention Photosensitive adhesive composition, photosensitive element using the same, method for forming resist pattern, and method for bonding bonded member
abstract PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition having good developability, sufficiently high photosensitive characteristics, and excellent cured film adhesive strength and reliability, a photosensitive element using the same, and a method for forming a resist pattern And a method for bonding a member to be bonded. (A) A polybenzoxazole precursor represented by the following general formula (1), (B) a photopolymerizable compound having an ethylenically unsaturated group in the molecule, and (C) a photopolymerization initiator, , (D) an epoxy resin, and a photosensitive adhesive composition. [Chemical 1] (In general formula (I), U or V represents a divalent organic group, and at least one of U or V includes a group having an aliphatic chain structure having 1 to 30 carbon atoms, or at least one of U or V is And a group represented by general formula (II) (in general formula (II), R 1 and R 2 are each independently trifluoromethane, and a represents an integer of 1 to 30). [Selection figure] None
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