abstract |
PROBLEM TO BE SOLVED: To provide a high-performance photosensitive resin composition having excellent lithography properties and a relief pattern after heat curing having extremely high heat resistance and chemical resistance. SOLUTION: (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator, and (D) a thermal crosslinking agent. A photosensitive resin composition containing is prepared. |