| abstract |
The present invention provides a radiation-sensitive resin composition having excellent patterning performance, particularly developability, heat-resistant flow property and development adhesion. A radiation-sensitive resin composition comprising an alkali-soluble resin (A), a photoacid generator (B), and an acidic phosphoric acid compound (C). The radiation sensitive resin composition may further contain a crosslinking agent. The acidic phosphoric acid compound (C) is preferably a compound having 1 or 2 hydroxyl groups. The acidic phosphoric acid compound (C) preferably has a phosphate ester structure. [Selection figure] None |