| abstract |
(57) [Summary] [Object] To provide a photoresist composition having high adhesion to a substrate and capable of reproducing a fine pattern even in a wet etching method, and an etching method using the same. A positive or negative photoresist composition comprises (a) an alkali-soluble resin, (b) a photosensitive compound, And (c) containing 0.001 to 10% by weight of an organic phosphoric acid compound with respect to (a), which is used as a resist in wet etching. |