| abstract |
【Task】 Conventionally used resin compositions have weak adhesion to the substrate, so that an aqueous solution of an organic alkali as a developer, particularly a 2.38% tetramethylammonium hydroxide aqueous solution generally used in semiconductor applications However, pattern peeling occurred and there was a problem that processing could only be performed with a dedicated developer having a concentration lower than 2.38%. The present invention has been made in view of the above circumstances, and an object thereof is to provide a photosensitive resin composition having excellent adhesion. [Solution] (A) a cyclic olefin-based resin having an acidic group, (B) a photoacid generator, (C) a compound having a reactive group capable of binding to the acidic group of (A) at a temperature of 130 ° C. or higher, and (D ) A photosensitive resin composition comprising a silane coupling agent having a sulfur atom in the molecule. [Selection] Figure 4 |