| abstract |
Provided is a resin composition for encapsulating an optical semiconductor element, which is excellent in both light transmittance after thermal history and crack resistance against thermal shock. An epoxy resin (A), an epoxy-modified organopolysiloxane (B) represented by the general formula (1), a curing agent (C), and inorganic oxide particles (D) having a volume average particle diameter of 1 to 100 nm. An epoxy resin composition for sealing an optical semiconductor element, which is formulated as an essential component. In the formula, R 1 is a hydrogen atom or a linear or branched aliphatic hydrocarbon group having 1 to 6 carbon atoms, X is a substituent containing an epoxy group, Y is R 1 or X, a and b are 1 to 300 is an integer, a / b is 0.1 to 300, and a plurality of R 1 , X and Y may be the same or different. [] Represents random bonds, block bonds, or a combination thereof. [Selection figure] None |