| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2003-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e87c5d9cf2871dd97e10d1998b9e31aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30efba884c80fdce56d6ca27a7dbf5c3 |
| publicationDate |
2005-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005120230-A |
| titleOfInvention |
Epoxy resin composition for optical semiconductor element sealing and optical semiconductor device using the same |
| abstract |
An epoxy resin composition for encapsulating an optical semiconductor element, which has a low internal stress and can obtain a good light transmittance in a wide temperature range. An epoxy resin composition for sealing an optical semiconductor element containing the following component (A). (A) An epoxy resin composite comprising an epoxy resin as a matrix component and the following (a) dispersed therein. (A) Silicon dioxide particles having an average particle diameter of 5 to 40 nm as measured by neutron small angle scattering (SANS). [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7985476-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005206664-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009227849-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007217242-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005298701-A |
| priorityDate |
2003-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |