| abstract |
The purpose of the present invention is to provide a curable epoxy resin composition which is capable of forming a cured product that has high heat resistance, light resistance and thermal shock resistance, while especially having excellent reflow resistance after moisture absorption. A curable epoxy resin composition of the present invention is characterized by containing (A) an alicyclic epoxy compound, (B) a monoallyl glycidyl isocyanurate compound represented by formula (1), and (C) a glass filler. It is preferable for the curable epoxy resin composition that the alicyclic epoxy compound (A) is a compound having a cyclohexene oxide group.n(In the formula, R 1 and R 2 may be the same as or different from each other, and each represents a hydrogen atom or an alkyl group having 1-8 carbon atoms.) |