| abstract |
The present invention relates to an apparatus for chemically etching a conductive layer (2) on a transparent substrate (1), the apparatus comprising a supporting means (4) for supporting the substrate (1) and a means for spraying a solution (5). It has. A feature of the present invention is that the spraying means (5) includes a plurality of nozzles (50) disposed above the substrate, and the nozzles are provided on at least two types of solutions (7, 8) on the layer to be etched. ) Separately, or mutually, or simultaneously as a mixture at the nozzle. |