| abstract |
【Task】 An object of the present invention is to provide a cleaning composition capable of etching titanium nitride without corroding a wiring material used for a semiconductor substrate, particularly copper or tungsten. [Solution] A processing solution for a wiring board containing a hydrogen peroxide, quaternary ammonium hydroxide and tungsten anticorrosive, and having a pH of 7 or more and 10 or less, wherein the tungsten anticorrosive is quaternary ammonium and a salt thereof, quaternary pyridinium And a salt thereof, quaternary bipyridinium and a salt thereof, and quaternary imidazolium and a salt thereof at least one selected from the group consisting of corrosive copper or tungsten by using a cleaning composition The present inventors have found that titanium nitride can be effectively etched without arriving at the present invention. [Selection figure] None |