| abstract |
The present invention provides a processing method of a workpiece that can be easily processed into a desired shape without causing mechanical damage and thermal damage. A sample 1 made of at least one material selected from the group consisting of silicon, silicon carbide, and a semiconductor containing a group III-V element is used as a workpiece, and the sample 1 is made of an oxidizing agent, a fluoride, By immersing in a treatment liquid 8 made of an aqueous solution containing hydrogen or fluoride ions, and contacting the wire 2 provided at least on the surface with a layer made of a catalyst in the oxidation reaction of the material in the treatment liquid 8, The portion of the sample 1 in contact with the wire 2 is oxidized and dissolved in the processing solution 8, and the sample 2 is cut or the sample 2 is moved by gravity as the sample 1 is dissolved. A notch is formed in the sample 1. [Selection] Figure 2 |