| abstract |
A pattern which is polyimide by heat treatment at 300 ° C. or less and has good chemical resistance after heat treatment is formed. According to the present invention, one or two or more tetracarboxylic dianhydrides and one or two or more aromatic diamines having an amino group and a phenolic hydroxyl group that are ortho to each other undergo dehydration condensation. (B) 1-100 parts by mass of photosensitive diazonaphthoquinone compound, (C) 100-1000 parts by mass of diluting solvent, and alkoxysilyl group-containing organic compound with respect to 100 parts by mass of (A) polycondensate having a structure. (D) The photosensitive resin composition containing 0.1-10 mass parts of adhesion promoters is provided. [Selection figure] None |