| abstract |
Photosensitive resin containing at least one alkali-soluble resin selected from polyimide, polybenzoxazole, polyimide precursor, polybenzoxazole precursor, and a copolymer of two or more polymers selected from these and a photosensitizer A photosensitive resin composition, further comprising a compound represented by the following general formula (1). Provided is a photosensitive resin composition that has excellent adhesion to a metal material, particularly copper, and exhibits high chemical resistance even when the cured film is fired at a low temperature. [Chemical 1] |