abstract |
An object of the present invention is to provide a photosensitive siloxane composition which has characteristics of high heat resistance, high transparency and low dielectric constant, and has small changes in sensitivity and unexposed portion residual film ratio over time. A photosensitive siloxane composition containing a) a polysiloxane, (b) a quinonediazide compound, (c) a solvent, and (d) an organosilane compound represented by the general formula (1). [Selection figure] None |