| abstract |
The positive photosensitive resin composition of the present invention is characterized in that it is a positive photosensitive composition containing (a) polysiloxane, (b) diazonaphthoquinone compound, (c) solvent, (a) poly The content ratio of the structure derived from the organosilane represented by the general formula (1) in the siloxane is 20% to 80% in terms of the Si atom molar ratio relative to the Si atom molar ratio of the entire polysiloxane, And it contains the structure derived from the organosilane represented by General formula (2). According to the positive photosensitive composition of this invention, the positive photosensitive composition which has the characteristic of high heat resistance and high transparency, and can form a high-resolution pattern with high sensitivity can be provided. In addition, it can be used for cured films such as flattening films for TFT substrates, interlayer insulating films, core materials, and cladding materials formed from the positive photosensitive composition of the present invention, and display elements and semiconductor elements having the cured films. , solid-state imaging devices, optical waveguides and other components. |