http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007161833-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 |
| filingDate | 2005-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc9a57f71cc7d7eb772f50137d55fbde |
| publicationDate | 2007-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007161833-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation having high flame resistance without using a flame retardant, excellent moldability, particularly continuous moldability, package appearance and solder reflow resistance, and the same And providing a semiconductor device in which a semiconductor element is sealed. SOLUTION: (A) a phenol aralkyl type epoxy resin having a phenylene skeleton, (B) a phenol aralkyl resin having a biphenylene skeleton, (C) an inorganic filler, (D) a triazole compound, (E) a secondary amino group. A silane coupling agent, (F) a compound in which a hydroxyl group is bonded to two or more adjacent carbon atoms constituting an aromatic ring, and (G) a glycerin trifatty acid comprising glycerin and a saturated fatty acid having 24 to 36 carbon atoms. An epoxy resin composition for encapsulating a semiconductor, comprising an ester as an essential component and the inorganic filler (C) in an amount of 84% by weight to 92% by weight in the total epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009235164-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016145650-A1 |
| priorityDate | 2005-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 91.