| abstract |
(57) Abstract: An epoxy resin molding material for sealing a semiconductor device in which a semiconductor chip having a thin, multi-pin, long wire, narrow pad pitch or semiconductor chip disposed on a mounting substrate is excellent in fluidity and reliability. This reduces the occurrence of molding defects such as sealed wire flow and voids and defects during reflow. Provided is a semiconductor device in which a semiconductor chip is arranged on a multi-pin, long wire, narrow pad pitch, or mounting substrate. SOLUTION: (A) a sulfur atom-containing epoxy resin, An epoxy resin molding material for sealing containing (B) a curing agent, (C) a silane coupling agent having a secondary amino group or (D) a phosphate ester as an essential component, and a semiconductor device sealed with the epoxy resin molding material. |