abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation, which has less mold contamination, and is excellent in releasability and moisture resistance. A glycerin trifatty acid ester of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and (E) glycerin and a saturated fatty acid having 24 to 36 carbon atoms. An epoxy resin composition for encapsulating a semiconductor, comprising: |