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filingDate 2000-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002080695-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation, which has less mold contamination, and is excellent in releasability and moisture resistance. A glycerin trifatty acid ester of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and (E) glycerin and a saturated fatty acid having 24 to 36 carbon atoms. An epoxy resin composition for encapsulating a semiconductor, comprising:
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