| abstract |
Disclosed is a material capable of forming a protective film for a flexible wiring circuit having high long-term reliability of electrical insulation, flexibility, small warpage due to curing shrinkage, and particularly low tack. (A) a carboxyl group-containing urethane resin using the following (a), (b) and (c) as raw materials; (A) a polyisocyanate compound, (B) a polyol compound, (C) a dihydroxy compound having a carboxyl group, (B) contains a curing agent, A thermosetting resin composition, wherein the polyol compound (b) is selected from one or more of the following group I polyol compounds and group II polyol compounds: (Group I): Polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, (Group II): Polybutadiene polyol, both-end hydroxylated polysilicone, and polyol having an oxygen atom only in the hydroxyl group and having 18 to 72 carbon atoms. [Selection figure] None |