| abstract |
A polymerizable compound, a photo-curing composition, and a photo-curable, moisture-proof insulating coating material for a mounting circuit board, which are excellent in surface curability with low environmental load, low irradiation dose and high adhesiveness to a substrate material, are provided. The compound of the present invention has a structural unit derived from a dimer diol, [Wherein R 1 represents H or CH 3 and R 2 represents a hydrocarbon group having 2 to 12 carbon atoms] as a terminal group. A group represented by the formula (1) and a group represented by the formula (2) [Wherein R 3 independently represents CH 3 or CH 2 CH 3 , and R 4 represents a hydrocarbon group having 3 to 9 carbon atoms] as a terminal group. The structure having a structural unit derived from dimerdiol is preferably represented by the formula (3). |