| abstract |
The present invention is a resin composition comprising a resin (A), a filler (B), and a solvent (C), wherein the solvent (C) is selected from the group consisting of propylene carbonate, dimethyl sulfoxide and sulfolane. Provided are a resin composition containing various organic solvents, a cured film obtained by curing the resin composition, and an application of the cured film to an overcoat for an electronic circuit board. The resin composition of the present invention has a high filtration rate at the time of preparation, excellent productivity, and a film obtained by curing has excellent long-term electrical reliability. Electrical insulating materials such as solder resist and interlayer insulating film, IC and VLSI sealing. It is useful in the fields of fastening materials, laminated plates and the like. |