| abstract |
PROBLEM TO BE SOLVED: To provide a composition containing quinolinols as a fluxing agent, an accelerator or both, particularly a composition for use as an underfill composition in electronic packaging where a solder joint is used for electrical interconnection. To do. An underfill composition comprising quinolinol or a quinolinol derivative as a fluxing agent, accelerator or both. This composition is sufficiently acidic to function well as a flux, but not so acidic that it causes premature gelation or corrosion. This composition also exhibits a higher Tg value than a similar composition without quinolinol or a quinolinol derivative. [Selection figure] None |