http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102455429-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2016-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102455429-B1 |
| titleOfInvention | Method for manufacturing flip chip package, flip chip package, and resin composition for pre-application type underfills |
| abstract | To provide a method for manufacturing a flip-chip mounted body capable of suppressing the generation of voids in a resin composition for underfill in a pre-supplied flip-chip bonding process. (1) a step of providing a solder layer on at least one of a copper bump electrode for connection provided in a semiconductor element and an electrode for connection provided on a circuit board, (2) (A) an epoxy resin, (B) an aromatic amine curing agent, (C) ) A step of supplying a resin composition for pre-supply type underfill containing an inorganic filler, (D) a silane coupling agent, and (E) a flux agent onto a circuit board, (3) thermocompression bonding the semiconductor element and the circuit board, and copper for connection A step of heating the bump electrode and the electrode for connection for at least 1 second at a temperature equal to or higher than the melting point of the solder, and then soldering them at a reaction rate within a specific range of the resin composition, and (4) curing the resin composition under a specific pressure. A method of manufacturing a flip-chip mounted body. |
| priorityDate | 2015-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.