http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170128224-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2016-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d967084a689ad24618dc0b90ff431360 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_468a0c426288b63a1ce91e3ad2d6b5c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_784c8a8ef019645e996ad4b095512f7c |
| publicationDate | 2017-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20170128224-A |
| titleOfInvention | Method for manufacturing flip chip package, flip chip package, and resin composition for pre-application type underfills |
| abstract | A method for producing a flip chip mounting body capable of suppressing generation of voids in a resin composition for underfill in a leadframe type flip chip bonding process. (1) a step of providing a solder layer on at least one of a copper bump electrode for connection provided in a semiconductor element and a connection electrode provided on a circuit board, (2) a step of (A) (3) a step of thermally bonding the semiconductor element and the circuit board to each other, and (4) bonding the semiconductor element and the circuit board to each other, A step of heating the bump electrode and the connecting electrode at a temperature equal to or higher than the melting point of the solder for 1 second or more, and then connecting the solder at a reaction rate within a specific range of the resin composition; and (4) In the flip chip mounting body. |
| priorityDate | 2015-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.