http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006512769-A
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-68 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-68 |
filingDate | 2003-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2006-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006512769-A |
titleOfInvention | Monitoring material adhesion to system components by light radiation |
abstract | Monitoring material material adhesion to system components due to light radiation United States Patent Application 20070227133 Kind Code: A1 A method and system for monitoring material material adhesion to system components in a plasma processing system is provided. The system component includes an emitter capable of producing characteristic fluorescent radiation when exposed to a plasma. The method utilizes light emission to monitor fluorescence emission from the emitter to determine the status of system components. The method can evaluate material material adhesion to system components in the plasma by monitoring the fluorescence emission from the emitter. Consumable system components that can be monitored using the method include rings, shields, electrodes, baffles, and liners. |
priorityDate | 2002-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.