| abstract |
An integrated circuit structure and a method for manufacturing the integrated circuit structure. The method includes forming a copper bond pad for attaching an integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. To attach the integrated circuit to the bump bonding package, an under bump metallization layer is formed on the reduced copper pad and a solder bump is formed thereon. This process can also be used for wire bonding processes by forming an aluminum layer over the cleaned copper pad. An integrated circuit structure according to the present invention includes a copper pad formed in a substrate. A passivation layer defining an opening therein covers the copper pad. An under bump metallization layer is disposed in the opening, and a solder bump covers the under bump metallization layer. Alternatively, the structure further comprises an aluminum pad disposed over the reduced copper pad. |