| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c08334531cafb7b671e6b92ec0105a37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81395
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02215 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2012-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1de9b1a2af4e28a55e6f58d9d36601b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bf7590251696a04e8bb668bdc9dc33e |
| publicationDate |
2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012169623-A |
| titleOfInvention |
Passivation layer for semiconductor device packaging |
| abstract |
An object of the present invention is to improve the reliability of electrical connection with a copper surface in a semiconductor device. The present invention provides a method of protecting the surface of a copper layer or copper bonding pad on a semiconductor device against oxidation. The surface of the layer or bonding pad is cleaned by removing the oxide layer with plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma enhanced deposition process to protect the cleaned surface of the layer against exposure to oxidizing gases. [Selection] Figure 1 |
| priorityDate |
2011-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |