| abstract |
The present invention provides a trench filling composition and a trench filling method suitable for use in embedding silicon oxide in a trench formed in a substrate. A trench filling composition comprises (A) It contains silicon oxide particles, (B) a silicon atom-containing binder component, and (C) a solvent. The trench embedding method is characterized in that the above-described trench embedding composition is applied on a substrate having a trench, and then this is heated and / or irradiated with light. [Selection figure] None. |