http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006294845-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 2005-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_486ac840b840a4508a4a04fcf8f8465f |
| publicationDate | 2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006294845-A |
| titleOfInvention | Dry etching method and apparatus |
| abstract | An object of the present invention is to provide a dry etching method and an apparatus therefor, which can increase the etching rate of the end portion of an object to be etched and make the in-plane etching rate uniform. To do. By making the material of the guide ring 9 SiO 2 , O 2 atoms in the SiO 2 sputter-etched by Ar ions contribute to the etching of the end portion of the object 6 to be etched, and the etching of the end portion is performed. You can increase the speed. [Selection] Figure 1 |
| priorityDate | 2005-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.