| abstract |
【Task】 The present invention is a photosensitive resin composition excellent in heat resistance, electrical characteristics, mechanical characteristics, etc. used for a surface protective film, an interlayer insulating film, etc. of a semiconductor element, and can be developed, cured at low temperature, and cured. The present invention provides a photosensitive resin composition having excellent adhesion as a later film property and a semiconductor device using the same. [Solution] A photosensitive resin composition comprising a cyclic olefin-based resin (A) having an epoxy group, a photoacid generator (B), and an organosilicon compound (C). |