| abstract |
[Problem] To provide a curable resin composition having excellent heat resistance, in particular, no change in storage elastic modulus (G ') from low temperature to high temperature, low viscosity and excellent workability. An epoxy resin and an acid anhydride group-containing silicone compound obtained by hydrolytic condensation of a specific acid anhydride group-containing alkoxysilane and / or an alkoxysilane containing at least the acid anhydride group-containing alkoxysilane. A curable resin composition to be contained. [Selection figure] None |