| abstract |
(57) [Summary] [PROBLEMS] To provide excellent heat strength, adhesiveness to various members such as a semiconductor element and a lead frame, and solder resistance at the time of mounting on a substrate, especially when the soldering temperature is higher than before. To provide an epoxy resin composition for semiconductor encapsulation which is excellent in adhesiveness and excellent in adhesion to a pre-plating frame of Ni, Ni-Pd, Ni-Pd-Au or the like. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a compound represented by the general formula (1) or a hydrolyzate of the compound represented by the general formula (1), (D) an inorganic filler, (E) An epoxy resin composition for semiconductor encapsulation, comprising a curing accelerator as an essential component. Embedded image |