http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006007300-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
filingDate 2004-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48df30ffb610606296eb20db240d84e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f926f15ddd498154a6fc79dc5281792
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publicationDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006007300-A
titleOfInvention Soldering flux
abstract [PROBLEMS] To reduce the occurrence of flux scattering and solder ball generation during soldering without deteriorating solderability, and to prevent residual flux from being peeled off after soldering and to generate cracks even when subjected to cold heat or shock. There is provided a soldering flux that is highly reliable and does not cause corrosion even in a high-temperature and high-humidity environment, and is used for soldering, such as greasy thread solder. A soldering flux produced by a polycondensation reaction between a dimer acid and a diamine, comprising 50 to 95% by weight of a polyamide resin having a softening point of 60 to 150 ° C., and the balance being rosin. A soldering flux produced by a polycondensation reaction between a dicarboxylic acid having 6 to 20 carbon atoms and a diamine, 50 to 95% by weight of a polyamide resin having a softening point of 60 to 150 ° C., and the balance being rosin. [Selection] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016032817-A
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priorityDate 2004-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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