| abstract |
The present invention provides a solder paste and a flux capable of suppressing heating dripping in a reflow soldering method. A solder paste includes a solder powder and a flux including a resin component, a solvent component, an activator, a thixotropic agent, and an additive. An additive contains the heating dripping suppression component shown to Formula (1) or Formula (2). [Chemical 1] (In the formula, R10 is an aliphatic hydrocarbon group having 14 or more carbon atoms. R11 is a hydrocarbon group.) [Chemical 2] (In the formula, R12 is a hydrocarbon group. R13 is a hydrocarbon group. R20 is an aliphatic hydrocarbon group having 14 or more carbon atoms.) [Selection figure] None |