| abstract |
PROBLEM TO BE SOLVED: To provide a polycarbonate resin composition excellent in thermal conductivity and molding processability and having little warpage of a molded product, and a molded body thereof. SOLUTION: (A) a polycarbonate resin and (B) a polyethylene terephthalate resin or a polybutylene terephthalate resin are (C) graphitized with respect to 100 parts by weight of a polycarbonate resin alloy having a weight ratio of 100: 5 to 100. Carbon fiber having a thermal conductivity in the length direction of 100 W / m · K or more and an average fiber diameter of 5 to 20 μm and less than 5 to 100 parts by weight of carbon fiber, and (D) a thermal conductivity of 10 W / A heat conductive polycarbonate resin composition comprising 0 to 400 parts by weight or less of a heat conductive powder having an average particle size of 1 to 500 μm and not less than m · K, and the heat conductive polycarbonate system A molded article obtained by molding a resin composition, which is useful as a casing for OA, electrical / electronic parts and precision equipment parts. [Selection figure] None |