http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8394489-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_02740af61d1dfb6f794306785d31c6a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_365cb65bbe95ada5e163eb420053f77d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 |
| filingDate | 2009-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21d3575104635e1a496044e500d5fa01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce3483604edd50d5e0ffaea611cef95a |
| publicationDate | 2013-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-8394489-B2 |
| titleOfInvention | Highly thermally conductive resin molded article |
| abstract | An object of the present invention is to industrially easily mold a molded article which is excellent in thermal conductivity, electric insulation property, low density, and an injection moldability and has a thermal conduction anisotropy. The present invention relates to a highly thermally conductive resin molded article having a thermal diffusion anisotropy, the highly thermally conductive resin molded article comprising a resin composition, the resin composition containing at least resin (A) and plate-like hexagonal boron nitride powder (B) in a (A)/(B) volume ratio falling within a range of 90/10 to 30/70, the resin (A) including a thermoplastic polyester resin and/or a thermoplastic polyamide resin, the highly thermally conductive resin molded article having a thickness of not more than 1.3 mm in a part of or all over a three-dimensional shape of the highly thermally conductive resin molded article, a thermal diffusivity measured in a plane direction of the highly thermally conductive resin molded article, being (i) two or more times higher than a thermal diffusivity measured in a thickness direction of the highly thermally conductive resin molded article and (ii) not less than 0.5 mm 2 /sec. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018105671-A1 |
| priorityDate | 2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 311.