| abstract |
Disclosed is a highly thermal conductive resin molded product that has high thermal conductivity, excellent electrical insulating properties, low density, and excellent injection moldability, has thermal conductivity anisotropy, and can be easily molded on a commercial scale. The highly thermal conductive resin molded product is produced by molding a composition comprising at least a thermoplastic polyester resin and/or a thermoplastic polyamide resin and a flaky hexagonal boron nitride powder having a number average particle diameter of not less than 15 μm at a resin/flaky hexagonal boron nitride powder volume ratio in the range of 90/10 to 30/70 so that a part or the whole of the volume of the molded product has a thickness of not more than 1.3 mm. The highly thermal conductive resin molded product is characterized in that the thermal diffusivity coefficient as measured in a plane direction in a plane having a thickness of not more than 1.3 mm is twice, or more than twice the thermal diffusivity coefficient as measured in a thickness-wise direction and the thermal diffusivity coefficient in the plane direction of the molded product is not less than 0.5 mm 2 /sec. |