| abstract |
An object of the present invention is to provide a release agent that has excellent resistance to corrosion and damage to copper wiring and low-k films, and excellent resist residue removal after ashing. [Solution] Resist stripper composition comprising two or more inorganic acid salts, surfactants, and metal corrosion inhibitors having different acid-derived components, and having a pH of 3 to 10 and the resist stripper A method for producing a semiconductor device, comprising: removing a resist residue generated at the time of manufacturing a semiconductor device using copper or a copper alloy containing copper as a main component and using as a wiring material. [Selection figure] None |