| abstract |
In a polishing fluid containing an oxidant, the oxidant promotes corrosion of the metal layer, and thus promotes dishing of the metal layer. Find a suitable second-step polishing fluid that contains no oxidizer and has a low abrasive concentration. A polishing fluid for second-step barrier removal polishing in copper CMP, which does not contain an oxidant and contains an organic acid, abrasive grains, and optionally a copper corrosion inhibitor, is applied to a barrier to metal and an insulating layer. High selection ratio of barriers. [Selection figure] None |