abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good moisture reliability and has a property of preventing dew condensation and can be suitably used for CCD applications. An epoxy resin composition containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components, the surface hydroxyl group concentration as an inorganic filler. And a porous inorganic filler having a mol of 1 mol / m 2 or more per unit area. |