http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005089710-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
filingDate 2003-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d90cbaa5dab53b15b212305dd18033b3
publicationDate 2005-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005089710-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good moisture reliability and has a property of preventing dew condensation and can be suitably used for CCD applications. An epoxy resin composition containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components, the surface hydroxyl group concentration as an inorganic filler. And a porous inorganic filler having a mol of 1 mol / m 2 or more per unit area.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10381533-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9387608-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008007560-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101090562-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013237865-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1990389-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008063466-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012254633-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008059856-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012212935-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007092002-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408541-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008059856-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013127068-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012227547-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7947343-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012238876-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408543-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408542-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408544-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105419236-A
priorityDate 2003-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8934
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID164912
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397310
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414871446
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456367111
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12749
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425042019
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425334797
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456373419

Total number of triples: 42.