http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008063466-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2006-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_953c0c11e6023718bfc41487f696eaf6 |
| publicationDate | 2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008063466-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | The present invention provides an epoxy resin composition that gives a cured product that does not have a poor appearance due to bleeding of a release agent and has excellent continuous moldability, and a semiconductor device sealed with the cured product of the resin composition. (A) Epoxy resin, (B) phenol resin curing agent, (C) inorganic filler is added to 400 to 1,200 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B), D) 0.1-5 parts by mass of curing accelerator with respect to 100 parts by mass of the total amount of components (A) and (B), and (E) a capsule type in which a release agent compound is encapsulated or supported in porous inorganic fine particles An epoxy resin composition containing 0.1 to 10 parts by mass of a release agent with respect to 100 parts by mass of the total amount of components (A) and (B) and a semiconductor device sealed with a cured product of the epoxy resin composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009286841-A |
| priorityDate | 2006-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.