| abstract |
Disclosed is a dielectric property suitable for use in a high frequency band of 1 GHz or more, having plating properties, high solder heat resistance, high solvent resistance, low linear expansion coefficient, high mechanical strength, Provided are a crosslinkable resin composition, a crosslinkable resin molded article, and a crosslinked resin molded article having low water absorption and good adhesion or adhesion to a metal layer, particularly a metal-clad substrate for a printed wiring board. . SOLUTION: To 100 parts by mass of a cyclic olefin resin (A), 0.3 to 2.5 parts by mass of an organic peroxide (B), 7 to 30 parts by mass of a crosslinking aid (C) and an inorganic filler (D 5) to 100 parts by mass are dispersed, and the cross-linkability capable of plating, in which the blending ratio (C / B) expressed by the mass of the crosslinking assistant (C) with respect to the organic peroxide (B) is 11 or more. It is a resin composition. This is molded to obtain a crosslinkable resin molded product, and further crosslinked by heating to obtain a crosslinked resin molded product. [Selection figure] None |