http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004342824-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2003-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c62080a3c4625a293268ce956ea37aac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_791da1c178e29a78d4e4e00c501d813b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f27808cdbccbc0fc0bc792074374c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac60d6180293211b7778093c1cffdd9c |
| publicationDate | 2004-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004342824-A |
| titleOfInvention | Method of forming conductor pattern |
| abstract | An object of the present invention is to form a high-definition conductive pattern of a printed wiring board in a short time, at a low cost, and reliably, and furthermore, the obtained conductive pattern is excellent in reliability such as adhesion to a base material and insulation between circuits. A technique for forming a conductive pattern. The conductive pattern forming method of the present invention comprises: (1) applying a photosensitive and electroless plating catalyst-supporting composition containing a chelating agent onto a substrate in a desired pattern; (2) curing the catalyst-carrying composition constituting the coating film pattern formed in (1) by irradiation with active energy rays; and (3) curing the composition in (2). (C) selectively supporting the electroless plating catalyst on the cured pattern of the catalyst supporting composition formed by the above method, and (4) subjecting the substrate after the step (3) to an electroless plating solution. Treating, and selectively forming an electroless plating film on the surface of a cured product of the catalyst-carrying composition carrying the catalyst for electroless plating. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014503999-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8703602-B2 |
| priorityDate | 2003-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 164.