| abstract |
PROBLEM TO BE SOLVED: To obtain a cured insulating film by applying a heat treatment at a low temperature of about 120 ° C. or less after application to a base material, and the cured film has adhesion to a base material or a sealing material. A good solution composition for insulating films with improved low-temperature curability and adhesion, and suitable as a printing ink or coating varnish for forming cured insulating films for electrical and electronic parts, etc. The purpose is to do. SOLUTION: (a) 100 parts by weight of an organic solvent-soluble polyimide siloxane, (b) 2 to 40 parts by weight of a polyvalent isocyanate, (c) 0.1 to 30 parts by weight of an epoxy compound, and (d) an organic solvent. A composition for a polyimidesiloxane insulating film, which contains and has improved low-temperature curability and adhesion, a cured insulating film formed by heat-treating the insulating film composition, and a cured insulating film Forming method. [Selection figure] None |