| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that can be suitably used for production of a circuit board and the like, has excellent adhesiveness, workability, and heat resistance, and has excellent resin fluidity and dielectric characteristics in the GHz band, and its Provide typical usage techniques. The thermosetting resin composition according to the present invention comprises (A) a polyimide resin component, (B) an epoxy resin component, and (C) an epoxy curing agent component as essential components. Include a specific epoxy resin. As a result, various properties such as adhesiveness, workability, heat resistance, resin fluidity, and dielectric properties in the GHz band are imparted to the thermosetting resin composition and the cured resin after curing in a well-balanced manner. Can do. [Selection figure] None |