| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent electrical characteristics and capable of forming a fine via hole with a laser when used as a resin layer of a circuit board. The present invention also provides a resin layer having excellent electrical characteristics and capable of forming fine via holes with a laser, a carrier material with a resin layer using the resin layer, and a circuit board. The resin composition of the present invention is a resin composition that constitutes an insulating layer of a circuit board that forms a via hole by laser irradiation, and includes a cyclic olefin resin having a functional group polymerizable in a side chain, and a laser. As a processability imparting agent, an azide derivative and a polymerization initiator are included. Moreover, the resin layer of this invention is comprised with the above-mentioned resin composition. In the carrier material with a resin layer of the present invention, the above-mentioned resin layer is formed on at least one side of the carrier material. Moreover, the circuit board of this invention has the above-mentioned resin layer. [Selection] Figure 2 |