| abstract |
An object of the present invention is to suppress polishing scratches, peeling, dishing and erosion, and to enable high-speed CMP of copper or an alloy mainly composed of copper. In particular, to enable CMP of copper or a copper-based alloy on a low-dielectric-constant insulating film that is easily peeled. SOLUTION: By using a plurality of anticorrosives, for example, BTA and imidazole in an abrasive-free polishing liquid, a protective film having excellent protective properties but easily removable by mechanical friction is formed. [Selection diagram] Fig. 1 |