| abstract |
(57) Abstract: A thermosetting polyimide resin composition having excellent heat resistance, a low dielectric constant and a low dielectric loss tangent, and a cured product having good mechanical properties such as tensile strength and tensile elongation can be obtained; and Provided is a method for producing a polyimide resin used for the polyimide resin composition. SOLUTION: Carboxyl group and number average molecular weight 300 ~ Thermosetting polyimide resin composition containing a polyimide resin (X) having a linear hydrocarbon structure of 6,000 and an epoxy resin (Y), and a polyisocyanate compound (a1) and a linear hydrocarbon structure A prepolymer (A) having a terminal isocyanate group obtained by reacting a polyol compound having a linear hydrocarbon structure portion with a polyol compound (a2) having a number average molecular weight of 300 to 6,000, A method for producing a polyimide resin, wherein an acid anhydride (B) of a polycarboxylic acid having three or more carboxyl groups is reacted in an organic solvent. |