| abstract |
(57) [Problem] To form a hybrid cured product which is excellent in heat resistance, low thermal expansion, insulation, and adhesion, and does not generate voids, cracks, etc., and is semi-cured. The present invention provides a specific resin composition for electrical insulation, an insulating material for electronic materials obtained from the composition, and a method for producing the material. SOLUTION: Bisphenol type epoxy resin (1), A resin composition for electrical insulation, comprising a methoxy group-containing silane-modified epoxy resin obtained by subjecting a novolak type epoxy resin (2) and a methoxysilane partial condensate (3) to demethanol condensation reaction; bisphenol type epoxy Modification of methoxy group-containing silane obtained by subjecting resin (1), novolak type epoxy resin (2), methoxysilane partial condensate (3) and epoxy compound (4) having one hydroxyl group in one molecule to demethanol condensation reaction A resin composition for electrical insulation characterized by containing an epoxy resin is used. |