abstract |
(57) [Problem] To provide an epoxy resin composition which can be a cured product having excellent heat resistance. SOLUTION: It contains an alkoxy group-containing silane-modified epoxy resin (A) obtained by subjecting a bisphenol-type epoxy resin (1) and a hydrolyzable alkoxysilane (2) to a dealcoholization reaction, and a curing agent (B) for an epoxy resin. An epoxy resin composition comprising: |